Molex Micro-Fit 3.0 Series Right Angle Through Hole PCB Header, 6 Contact(s), 3.0mm Pitch, 2 Row(s), Shrouded

RS tilauskoodi: 670-0365Tuotemerkki: MolexValmistajan osanumero.: 43045-0601
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Tekninen dokumentti

Tekniset tiedot

Merkki

Molex

Series

MICRO-FIT 3.0

Pitch

3.0mm

Number Of Contacts

6

Number Of Rows

2

Body Orientation

Right Angle

Shrouded/Unshrouded

Shrouded

Connector System

Wire to Board

Mounting Type

Through Hole

Termination Method

Solder

Contact Plating

Gold

Contact Material

Brass

Current Rating

5.0A

Series Number

43045

Voltage Rating

250.0 V

Alkuperämaa

Mexico

Tuotetiedot

Molex Micro-Fit 3.0 3.0mm Dual Row PCB Headers with Snap in Plastic Peg PCB Lock, 43045 Series

Micro-Fit 3.0 3mm pitch wire to board dual row PCB headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. The through hole mounting versions of these Micro-Fit 3.0 headers are also SMT compatible which means a reduction in process requirements and costs. To secure these Micro-Fit 3.0 headers to the PCB board, snap-in plastic peg PCB locks are incorporated into the connector design. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs

Molex Micro-Fit 3.0 Series

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Varastotiedot eivät ole tilapäisesti saatavilla.

€ 2,60

1 kpl (5 kpl/pakkaus) (ilman ALV)

€ 3,224

1 kpl (5 kpl/pakkaus) (Sis ALV:n)

Molex Micro-Fit 3.0 Series Right Angle Through Hole PCB Header, 6 Contact(s), 3.0mm Pitch, 2 Row(s), Shrouded
Valitse pakkaustyyppi

€ 2,60

1 kpl (5 kpl/pakkaus) (ilman ALV)

€ 3,224

1 kpl (5 kpl/pakkaus) (Sis ALV:n)

Molex Micro-Fit 3.0 Series Right Angle Through Hole PCB Header, 6 Contact(s), 3.0mm Pitch, 2 Row(s), Shrouded
Varastotiedot eivät ole tilapäisesti saatavilla.
Valitse pakkaustyyppi

Osta irtotavarana

MääräYksikköhintaPer Pakkaus
5 - 95€ 2,60€ 13,00
100 - 370€ 1,80€ 9,00
375 - 1495€ 1,70€ 8,50
1500 - 2995€ 1,30€ 6,50
3000+€ 1,25€ 6,25

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Tekninen dokumentti

Tekniset tiedot

Merkki

Molex

Series

MICRO-FIT 3.0

Pitch

3.0mm

Number Of Contacts

6

Number Of Rows

2

Body Orientation

Right Angle

Shrouded/Unshrouded

Shrouded

Connector System

Wire to Board

Mounting Type

Through Hole

Termination Method

Solder

Contact Plating

Gold

Contact Material

Brass

Current Rating

5.0A

Series Number

43045

Voltage Rating

250.0 V

Alkuperämaa

Mexico

Tuotetiedot

Molex Micro-Fit 3.0 3.0mm Dual Row PCB Headers with Snap in Plastic Peg PCB Lock, 43045 Series

Micro-Fit 3.0 3mm pitch wire to board dual row PCB headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. The through hole mounting versions of these Micro-Fit 3.0 headers are also SMT compatible which means a reduction in process requirements and costs. To secure these Micro-Fit 3.0 headers to the PCB board, snap-in plastic peg PCB locks are incorporated into the connector design. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs

Molex Micro-Fit 3.0 Series